Breakthrough in next-generation semiconductor packaging technology Samsung announces completion of development of I-Cube4

Seoul, South Korea, May 6, 2021/PRNewswire/ - Recently, Samsung Semiconductor has developed a new generation that can encapsulate logic chips and 4 high-bandwidth memories (HBM). 2.5D packaging technology "I-Cube4".

"I-Cube4" is called "Interposer-Cube4" in full. As a brand of Samsung's 2.5D packaging technology, it is a new generation of packaging technology that uses silicon interposers to arrange and package multiple chips in one chip.

The silicon interposer (Interposer) refers to the microcircuit board inserted between the high-performance chip running at high speed and the PCB board running at low speed. The silicon interposer is connected to the logic chip and HBM placed on it through the Through Silicon Via (TSV) microelectrode, which can greatly improve the performance of the chip. Using this technology can not only improve chip performance but also reduce the packaging area. Therefore, it will be widely used in the fields of high-speed data transmission and high-performance data processing, such as high-performance computing (HPC, High-Performance CompuTIng), artificial intelligence/cloud services, data centers, etc. In particular, Samsung Semiconductor uses a unique semiconductor manufacturing process technology that can prevent the ultra-thin interposer from deforming at 100 microns (μm) and uses a unique structure that does not contain sealants to improve heat dissipation performance.

"The importance of a new generation of packaging technology focused on high-performance computing is becoming increasingly prominent." Said Jiang Wensu, general manager of the marketing strategy department of Samsung Semiconductor (Foundry), "based on the mass production experience of'I-Cube2', and' I-Cube4' is highly competitive with commercial differentiated technologies. Samsung will develop new technologies with 6 or 8 HBMs as soon as possible and bring them to the market.It is worth mentioning that in 2018, Samsung The market demonstrated the "I-Cube2" solution that integrates logic chips and two HBMs; in 2020, Samsung released a new generation of highly differentiated "X-Cube" technology that can integrate logic chips and SRAM performs vertical 3D stacking.